Tignis Raises $7.2M in Series A Funding

Tignis, SeattleInnovator based in WA inAI process control for semiconductor production, raised $7.2M in Series A funding.

TheRound was led by DN CapitalParticipation from Clear Ventures, Paul Maritz Harel Kodesh.

TheCompany plans to use the funds in order to grow its sales team, and to execute on current contracts.

LedBy CEO Jon Herlocker, TignisInnovative software solutions using AI and other technologies are sold by the company. Machine LearningTo enable next-generation semiconductor manufacturing (physics driven AI process control), increase manufacturing yield, decrease process downtime, and enable next-generation semiconductor manufacturing. The company’s products equip process and operations engineers with the tools necessary to design, test and implement AI projects, and ensure the implementation of AI process control and monitoring initiatives. ItsTechnology is deployed inThere are many facilities all over the globe.

Launched in 2021, Tignis’ PAICe Product SuiteAccelerates the ability to create, validate, and deploy machine learning-enabled, physics-driven solutions in semiconductor manufacturing. PAICe MonitorAllows process engineers to quickly harness data with the proprietary low-code language, to find and solve problems in production. MakerSimulators can be run faster, allowing semiconductor manufacturers to control complex OEM machinery adaptively. inReal-time

In addition to today’s funding announcement, the company has raised $7.4 million inAngel and seed funding since 2017, excluding a $1 million investment in2021 from innovation firm BMNT. ItAlso completed the H4XLabs enterprise accelerator program to accelerate the development of its first product.



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